• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Apparatus for producing a three-dimensional object by selective additive manufacturing, comprising: - a support (140) adapted to support at least one layer (150) of additive manufacturing powder, - a laser source (110) adapted to emit a laser beam (111) a scanning device (130) adapted to direct the laser beam on the powder layer so as to scan at least a portion of the powder layer; - a scan path modulation device (120) arranged upstream of the scanning device, the modulation device comprising a modulation mirror (121) adapted to reflect the laser beam from the laser source and direct it towards the scanning device, the angle of incidence of the laser beam from the laser source on the modulation mirror being between 20 and 45 °.
    公开号:FR3080321A1
    申请号:FR1853547
    申请日:2018-04-23
    公开日:2019-10-25
    发明作者:Gilles Walrand；Franck Denavit
    申请人:AddUp SAS；
    IPC主号:
    专利说明:

    Selective additive manufacturing consists of making three-dimensional objects by consolidating selected areas on successive layers of powdery material (metallic powder, ceramic powder, etc.). The consolidated areas correspond to successive sections of the three-dimensional object. Consolidation takes place, layer by layer, by a total or partial selective merger carried out with a source of consolidation. This source is conventionally a source of radiation (for example of a high power laser beam) or else a source of particle beam (for example of an electron beam - technology called EBM or “Electron Beam Melting” according to the Anglo-Saxon terminology generally used in the field).
    However, conventional additive manufacturing devices have a productivity today considered insufficient.
    In order to increase the productivity of additive manufacturing devices, the number of laser sources can be increased. However, this has multiple drawbacks. The effectiveness of such a system is limited. The presence of different laser sources poses congestion problems. Furthermore, the multiplication of laser sources has a significant cost.
    PRESENTATION
    An object of the invention is to overcome at least one of the drawbacks presented above.
    To this end, an apparatus is provided for manufacturing a three-dimensional object by selective additive manufacturing, comprising:
    a support adapted to support at least one layer of powder of additive manufacturing, a laser source adapted to emit a laser beam, a scanning device adapted to direct the laser beam on the layer of powder so as to scan at least part of the powder layer, a scanning path modulation device, arranged upstream of the scanning device, the modulation device comprising a modulation mirror adapted to reflect the laser beam coming from the laser source and direct it towards the scanning device, the angle of incidence of the laser beam from the laser source on the modulation mirror being between 20 and 45 °.
    The invention is advantageously supplemented by the following characteristics, taken alone or in any of their technically possible combinations:
    the scanning device comprises a first scanning mirror and / or a second scanning mirror, the scanning device being adapted to modify the orientation of the first scanning mirror along a first scanning rotation axis and / or of the second scanning mirror scanning along a second scanning rotation axis, the modulation device is adapted to modify the orientation of the modulation mirror along a first modulation rotation axis and / or a second modulation rotation axis, the scanning device is suitable to modify the orientation of the first scanning mirror along the first scanning rotation axis over a first range of scanning angle values and / or of the second scanning mirror along the second scanning rotation axis over a second range of values of scanning angles, the modulation device is adapted to modify the orientation of the modulation mirror along the first axis of rotation d e modulation on a first range of modulation angle values and / or the second axis of rotation of modulation on a second range of modulation angle values, the first and / or second range (s) of angle values is more extensive than the first and / or second range (s) of modulation angle values, the scanning device is configured to modify the orientation of the first scanning mirror along the first scanning rotation axis and / or of the second scanning mirror along the second scanning rotation axis, at a scanning rotation speed, in which the modulation device is configured to modify the orientation of the modulation mirror along the first modulation rotation axis and / or the second modulation rotation axis, at a modulation rotation speed, the scanning rotation speed is lower than the modulation rotation speed, the scanning device comprises l e first scanning mirror and the second scanning mirror, the first scanning mirror being adapted to reflect the laser beam coming from the modulation mirror and direct it towards the second scanning mirror, the second scanning mirror being adapted to reflect the beam laser from the first scanning mirror and direct it onto the layer of additive manufacturing powder, the system being adapted to control the orientation of the first scanning mirror along the first scanning rotation axis and of the second mirror along the second scanning axis scanning rotation to control the scanning path of the powder layer by the laser beam according to two degrees of freedom in a plane of the powder layer, the modulation device is adapted to modulate the trajectory according to a modulation comprising an oscillation at a frequency greater than 1.5 kHz, preferably greater than or equal to 10 kHz, the angle of incidence of the laser beam from the laser source on the modulation mirror is between 25 and 35 °, the angle of incidence of the laser beam from the laser source on the modulation mirror is between 28 and 32 °, the modulation includes silicon carbide, the modulation mirror is a plane mirror of elliptical shape.
    The invention also relates to a method for manufacturing a three-dimensional object by selective additive manufacturing, implemented by means of such an apparatus, comprising the following steps:
    control of the scanning device according to a scanning command of at least a portion of the layer of powder of additive manufacturing according to a scanning trajectory, and at the same time as the control of the scanning device, control of the modulation device according to a command modulating the scanning path, so that the laser beam follows at the powder layer a modulated scanning path.
    The invention is advantageously supplemented by the following characteristics, taken alone or in any of their technically possible combinations:
    in the step of controlling the modulation device, the modulation device is controlled so as to modify the orientation of the modulation mirror according to the first and / or second axis (s) of modulation rotation at a modulation rotation speed , in the step of controlling the scanning device, the scanning device is controlled so as to modify the orientation of the first scanning mirror along the first scanning rotation axis and / or of the second scanning mirror along the second axis rotation speed at a lower speed than the modulation speed.
    DRAWINGS
    Other objectives, characteristics and advantages will appear on reading the following description given by way of illustration and not limitation with reference to the drawings, among which:
    FIG. 1 schematically represents an apparatus according to an exemplary embodiment of the invention, FIG. 2 represents a perspective view of the apparatus of FIG. 1, FIGS. 3a, 3b, 3c, 4a and 4b represent patterns trajectories according to an exemplary embodiment of the invention, FIG. 5 represents a method according to an exemplary embodiment of the invention,
    DESCRIPTION
    General structure of the device
    With reference to FIGS. 1 and 2, an apparatus 1 is described. The apparatus 1 can be an apparatus 1 for manufacturing an object, for example by additive manufacturing, for example by selective additive manufacturing. The object can be a three-dimensional object.
    The device 1 can comprise a support 140. The support 140 can be adapted to support at least one layer 150 of material, for example of additive manufacturing material. The layer 150 of material may be a layer 150 of powder, for example powder of additive manufacturing.
    The apparatus 1 may include a source 110. The source 110 may be a source of consolidation. The source 110 can be a radiation source, for example a laser source, for example a laser light source, for example adapted to emit a laser beam.
    The apparatus 1 can comprise a scanning device 130. The scanning device can be adapted to direct the laser beam, for example on the layer 150, for example so as to scan at least part of the layer 150, for example according to a scanning path.
    The apparatus 1 comprises a device 120, for example a modulation device 120, for example a scanning path modulation device. The device 120 can be arranged upstream of the scanning device 130. The device 120 can comprise a mirror 121, for example a modulation mirror 121. The mirror 121 can be adapted to reflect the laser beam coming from the laser source and / or direct it towards the scanning device. The angle a of incidence of the laser beam coming from the laser source on the mirror 121 is between 20 and 45 °, and / or the angle formed between the laser beam coming from the laser source and directed towards the device 120 and the laser beam coming from the device 120 and directed towards the scanning device 130 is between 40 and 90 °.
    By angle of incidence is meant the angle between the direction of propagation of the laser beam and the normal to the mirror at the level of the surface of the mirror encountered by the laser beam.
    By upstream and downstream is meant upstream and downstream relative to the direction of the photon flow of the laser beam emitted by the laser source, that is to say relative to the optical path of the laser beam. It is thus possible to modulate the main trajectory defined by the scanning device 130 by means of prior modulation and to obtain a modulated trajectory.
    In fact, the modulation of the trajectory makes it possible to improve the distribution of energy supplied by the laser source, which results in a widening of the weld pool, hence a wider bead of fused material and a reduction in the number of vectors corresponding to the laser paths and therefore an increase in the melting rate, that is to say a larger fused area for the same unit of time. To obtain a correct fusion, a material needs a quantity of energy per unit of time, called fluence, expressed for example in J / mm 2 . If the fluence is too weak, the fusion is not complete and the material will not have the expected characteristics. If the fluence is too high, generally at the center of the laser spot, the fusion bath will be too dynamic, which will cause unwanted phenomena such as projections, sparks, large fumes disturbing the laser beam, or bubbling. Such unwanted phenomena degrade the quality of the material obtained. Thus, for a given laser spot diameter, the laser energy and the melting speed, and therefore the productivity, are limited in the prior art. The invention makes it possible to introduce, by means of a modulation device which does not harm the compactness and efficiency, modulations making it possible to superimpose on the main trajectory a secondary trajectory on the powder bed.
    It is thus possible to overcome the limitations specific to a point laser spot and to a rectilinear trajectory by introducing modulations in the trajectory.
    The apparatus thus makes it possible to increase the efficiency of the transfer of energy to the material. Indeed, the power of a laser beam being strongly localized, the material such as the powder quickly fuses and the resulting molten bath acts as a mirror vis-à-vis the photons. This results in a significant re-emission of the energy supplied in this context.
    It is thus possible to obtain a more effective solution while remaining simple to implement and while limiting the associated costs.
    Unlike adding multiple laser sources, it is possible to limit the costs of both obtaining the laser sources and the power required to use them.
    The modulation of the trajectory also allows better control of the dynamics of cooling of the molten bath and therefore makes it possible to improve the state, in particular the metallurgical state in the case of a metal, of the material formed.
    The modulation also makes it possible, by choosing the modulation pattern, to adjust the amount of energy deposited over the width of the fusion bath, so as to adjust the energy, for example between the edges and center of the fusion bath or between a edge, center and another edge, so as to limit unwanted phenomena such as projections and / or sparks.
    In addition, it is thus possible to obtain an efficient and compact device by the choice of the relative arrangement between the source, the modulation device and the scanning device.
    Indeed, the device is particularly compact compared to a solution with several laser sources. The claimed arrangement requires only a laser and is particularly compact without compromising quality in terms of additive manufacturing.
    In particular, such a choice of angle makes it possible to reduce the reflection zone and therefore to reduce the dimensions of the modulation mirror and therefore its inertia. It is thus possible to reach high oscillation frequencies, for example greater than 1.5 kHz, and therefore to increase the efficiency of the modulation device.
    In addition, such a device can be obtained by modifying existing devices without requiring a major modification of the scanning device, for example without interfering with the actuator control system of the scanning device.
    Laser source
    The laser source 110 comprises for example a fiber laser, for example a continuous laser, for example a single-mode laser with a Gaussian energy distribution.
    The laser beam may have a power greater than or equal to 250 W, for example greater than or equal to 500 W, for example less than or equal to 5000 W, for example less than or equal to 3000 W, for example between 750 and 2500 W, for example equal to 1000 or 2000 W.
    The laser beam can come into contact with the layer 150 of powder by forming a laser spot or spot. The spot can have a given diameter, for example greater than or equal to 50 or 60 pm, for example less than or equal to 300 or 250 pm, for example between 50 and 250 pm, for example equal to 70 or 150 or at 250 pm.
    The laser beam used has for example a wavelength of 1070 nm.
    The apparatus 1 may comprise an optical element 1101 for controlling the focusing length, for example an optical lens for controlling the focusing length, for example disposed at the output of the laser source.
    The optical element for controlling the focusing length can be moved so as to adjust the focusing length, for example movable so as to approach it and / or move it away from the laser source 110, for example movable along of the axis formed by the laser beam 111 leaving the laser source.
    The apparatus 1 may comprise a focusing device 1102 between the optical element for controlling the focusing length, for example arranged between the laser source 110 and the modulation device 120.
    The apparatus 1 can comprise a device for shaping the laser beam (“shaping” in English terminology), for example so as to homogenize the energy brought to the surface, for example the upper surface, of the part of the swept powder layer, for example so as to obtain a top hat energy distribution (“top hat” in English terminology) or donut type. The shaping device can be or comprise a diffractive lens or a refractive element.
    Scanning device
    The scanning device 130 can comprise a first scanning mirror 131 and / or a second scanning mirror 132. The scanning device 130 can thus be adapted to modify the orientation of the first scanning mirror 131 and / or the second scanning mirror. scanning 132 along one or more axis (s) of rotation (s), for example over a range of values of scanning angles. The scanning device 130 can be adapted to modify the orientation of the first scanning mirror 131 along a first scanning rotation axis.
    133, for example on a first range of values of scanning angles. The scanning device 130 can be adapted to modify the orientation of the second scanning mirror 132 along a second scanning rotation axis.
    134, for example on a second range of values of scanning angles.
    The scanning device 130 can be configured to modify the orientation of the first scanning mirror 131 along the first axis of rotation.
    133 of scanning and / or of the second scanning mirror 132 along the second axis of rotation 134 of scanning, at a scanning speed of rotation.
    The first scanning mirror 131 can be adapted and / or controlled to reflect the laser beam 112 coming from the modulation mirror 121 and direct it towards the second scanning mirror 132. The second scanning mirror 132 can be adapted to reflect the laser beam from the first scanning mirror
    131 and direct it on the layer 150. The system can be adapted to control the orientation of the first scanning mirror 131 along the first scanning rotation axis 133 and of the second mirror 132 along the second scanning rotation axis 134 to control the scanning path of the layer 150 by the laser beam according to two degrees of freedom, for example in a plane of the powder layer, for example in two directions of the plane of the powder layer. The plane of the powder layer may be a plane corresponding to a surface, for example an upper surface, of the powder layer.
    The scanning device 130 can comprise at least one actuator, for example to modify the orientation of the first scanning mirror 131 and / or of the second scanning mirror 132. The scanning device 130 can thus comprise a first actuator to modify the orientation of the first scanning mirror 131 along the first scanning axis of rotation 133 and a second actuator for modifying the orientation of the second scanning mirror 132 along the second axis of rotation 134.
    The first scanning mirror 131 and / or the second scanning mirror
    132 may be a plane mirror, and / or a mirror of shape, for example of cutting shape, elliptical, or rectangular, for example square, or circular.
    The scanning device 130 can be adapted to impose on the laser beam, or direct the laser beam along, a scanning trajectory or main trajectory at at least part of the layer 150 of powder of additive manufacturing. The scanning trajectory or main trajectory corresponds to the trajectory which would be followed by the laser beam in the absence of modulation by the modulation device 120. It therefore corresponds to a certain control of the scanning device 130. The final trajectory therefore depends on the main trajectory and the secondary trajectory as described below.
    The main trajectory may include one or more sections, for example rectilinear. The section (s) correspond (s) to trajectory portions where the beam would actually wait for the layer 150 of powder in the absence of modulation, thus forming the spot according to the sections. Sections, for example, form vectors.
    The trajectory may include one or more jumps separating two sections, corresponding to portions where no laser beam would effectively reach the layer 150 of powder in the absence of modulation because at the corresponding time no laser beam is emitted or does not reach the scanning device 130.
    At least two sections, for example two successive sections, can be separated by a spacing, called the vector spacing. The successive sections of the main trajectory are for example separated by the same spacing. The spacing is for example greater than 100 pm, for example greater than 200 pm, for example greater than 400 pm, for example less than 1000 pm, for example less than 700 pm, for example equal to 500 pm. The device comprising the modulation device allows an increase in the vector spacing compared to the prior art and therefore greater efficiency by reducing the length of the main trajectory and therefore the manufacturing time.
    The scanning device 130 may include a three-axis scanning head. The device 1 can then preferably comprise the optical element for controlling the focusing length 1101 and / or the focusing device 1102 described above.
    The scanning device 130 may include a two-axis scanning head. The apparatus 1 may then preferably comprise a focusing device between the scanning device 130 and the layer 150. The focusing device comprises for example a lens, for example a flat field lens, for example an F-Theta lens.
    Modulation device
    The modulation device 120 can be adapted to modify the orientation of the modulation mirror 121, for example by rotation, for example along at least one axis of rotation, over a range of values of modulation angles. The modulation device 120 can be adapted to modify the orientation of the modulation mirror 121, for example along a first modulation rotation axis 122, for example over a first range of modulation values. Alternatively or in addition, the modulation device 120 can be adapted to modify the orientation of the modulation mirror 121 along a second modulation rotation axis 123, for example over a second range of modulation values. The first axis of rotation 122 of modulation and the second axis of rotation 123 of modulation can be two orthogonal axes.
    The first range of modulation values and / or the second range of modulation value has for example an amplitude between +/- 0.0025 rad and +/- 0.0015 rad, for example +/- 0.002 rad.
    The range of scan angle values can be wider than the range of modulation angle values. The first and / or second range (s) of scan angle values may be wider than the first and / or second range (s) of modulation angle values. In fact, the modulations aim to modulate the scanning which determines the main trajectory, for example by imposing a secondary trajectory which is superimposed on the main trajectory resulting from the control of the scanning device 130.
    The modulation device 120 can be configured to modify the orientation of the modulation mirror 121 along the first axis of rotation 122 of modulation and / or the second axis of rotation 123 of modulation, at a modulation rotation speed. The scanning rotation speed may be lower than the modulation rotation speed. Indeed, the modulation device thus makes it possible to offer greater responsiveness.
    The modulation device 120 can comprise at least one actuator, for example to modify the orientation of the modulation mirror 121. The modulation device 120 can thus comprise a first actuator to modify the orientation of the modulation mirror along the first axis of modulation rotation 122 and a second actuator for modifying the orientation of the modulation mirror along the second modulation rotation axis 123.
    The at least one actuator, for example the first actuator and / or the second actuator, can be or comprise a piezoelectric actuator, for example adapted to oscillate at least at an oscillation frequency greater than or equal to 1 kHz, by example greater than 1.5 kHz, for example greater than 2 kHz, for example less than 15 kHz, for example less than 12 kHz, for example between 1.5 and 10 kHz. Such an actuator makes it possible to reach high frequencies, while being compact, and inexpensive. Furthermore, such an actuator allows great angular precision on the position during modulation, that is to say control of the amplitude, and on the return to a reference position corresponding to an absence of modulation.
    The at least one actuator, for example the first actuator and / or the second actuator, can be or comprise an electromagnetic or mechanical actuator.
    The at least one actuator, for example the first actuator and / or the second actuator, can be or comprise an electromechanical microsystem, also called MEMS ("microelectromechanical Systems" in English terminology), for example adapted to oscillate at least an oscillation frequency greater than 10 kHz, for example greater than 15 kHz, for example equal to 20 kHz. Such a high modulation frequency increases the main scanning speed while maintaining a satisfactory pattern density on the layer.
    The at least one actuator, for example the first actuator and / or the second actuator, can be or comprise a galvanometer.
    The angle of incidence of the laser beam coming from the laser source on the mirror 121 can be between 25 and 35 °, and / or the angle formed between the laser beam coming from the laser source and directed towards the device 120 and the laser beam coming from the device 120 and directed towards the scanning device 130 can be between 50 and 70 °.
    The laser beam may have a diameter of between 20 and 40 mm when it is reflected on the modulation mirror, for example around 23 mm in diameter and / or a diameter of between 50 and 100 μm at the level of the surface of the layer. powder.
    For an angle of incidence of 45 °, for a laser beam of about 30 mm in diameter when it is reflected on the modulation mirror, the modulation mirror must have an elliptical reflection area of at least 42 mm in length and 30 mm in width. On the contrary, for an angle of incidence of 30 °, the modulation mirror can have an elliptical reflection area 35 mm in length and 30 mm in width. The associated mass is therefore reduced by around 18%.
    The angle of incidence of the laser beam from the laser source on the modulation mirror can be between 28 and 32 °, for example equal to 30 °.
    The modulation mirror 121 may be a mirror, for example a plane mirror, of shape, for example of cut shape, elliptical. Such a shape is particularly suitable for limiting the amount of material, which allows rapid oscillation, without limiting the area that can be reached by the laser on the surface of the powder layer.
    The elliptical mirror, for example, has a length between Df / cos (a) and 2 Df / cos (a), where Df is the diameter of the laser beam and the angle of incidence of the laser beam from the source laser on the modulation mirror, for example equal to 1.6 Df / cos (a). The mirror has for example a width between Df and 1.1 Df, for example equal to Df. Df is for example the diameter of the laser beam at 1 / e 2 , or D86 at 86% of the energy of a Gaussian spot.
    Alternatively, the modulation mirror 121 can be a rectangular mirror, for example a square mirror, or a circular mirror.
    The modulation mirror 121 may include a substrate and a reflection surface coating. Such a coating improves the reflection of photons on the mirror. Such a coating makes it possible to avoid or limit the absorption of the energy of the laser beam by the mirror, avoids or limits heating of the mirror, heating causing distortion and reducing the quality of the beam. Such a coating thus makes it possible to increase the life of the modulation mirror. The modulation mirror 121 comprises for example silicon carbide. The mirror comprises for example a substrate, the substrate being for example made of silicon carbide and / or consists essentially of silicon carbide. Silicon carbide offers good performance in terms of mass / stiffness, without having the disadvantages specific to materials such as berylium, for example the toxicity and difficulty of supply, as well as the cost of supply. It is thus possible to further reduce the mass and therefore the inertia of the modulation mirror, and therefore to further increase the oscillation frequency of the actuator (s) of the modulation device 120.
    The modulation device 120 can be adapted to modulate the trajectory according to a modulation. The modulation device 120 can thus be adapted to impose on the laser beam, or direct the laser beam according to, a modulation trajectory or secondary trajectory which is superimposed on the main trajectory at the level of at least part of the layer 150 of powder. additive manufacturing.
    The modulation mirror 121 can be adapted to oscillate, for example along at least one axis, for example along two axes, for example along the first axis of rotation 122 of modulation and / or along the second axis of rotation 123 of modulation. The modulation mirror 121 can thus be adapted to oscillate simultaneously and / or independently along the two axes, for example along the first axis of rotation 122 of modulation and / or along the second axis of rotation 123 of modulation.
    The modulation mirror 121 can thus be adapted to oscillate according to first oscillations along the first axis of rotation 122 of modulation and / or according to second oscillations along the second axis of rotation 123 of modulation. The modulation mirror 121 can be adapted to oscillate simultaneously according to first oscillations along the first axis of rotation
    122 of modulation and according to second oscillations along the second axis of rotation 123 of modulation, for example to generate a sinusoidal or circular pattern. The oscillations along the first axis of rotation 122 of modulation and / or along the second axis of rotation 123 of modulation can be controlled in amplitude and / or in frequency, for example independently between the two axes 122 and 123.
    The oscillations along the first axis of rotation 122 of modulation can be controlled so as to have a phase shift with respect to the oscillations along the second axis of rotation 123. Controlling the phase shift allows for example to adjust the shape of the pattern, change the shape of the pattern and / or orient the pattern along the scanning direction.
    The oscillations allow for example resulting oscillations, for example specific to the secondary trajectory, at the level of the layer 150 of powder, of amplitude greater than 100 μm, for example greater than 200 μm, for example less than 2000 μm, for example less than 1000 pm, for example less than 750 pm, for example equal to 500 pm. The oscillations can increase the width of the weld pool for the same speed of movement of the spot and the same fluence. It is thus possible to increase the vector spacing and therefore the surface productivity proportionally.
    The modulation mirror can be adapted to oscillate at a frequency greater than 1.5 kHz, preferably greater than 2.5 kHz, preferably greater than or equal to 10 kHz, for example along the first axis of modulation rotation 122 and / or the second modulation rotation axis 123. The modulation can comprise a pattern, for example a periodic pattern, for example repeated at a frequency greater than 1.5 kHz, preferably greater than 2.5 kHz, preferably greater than or equal to 10 kHz. The pattern is for example an oscillation. Modulation can form a pattern. It is thus possible, using the modulation device, to introduce modulations.
    The secondary path may include a pattern, for example so as to superimpose a pattern on the main path at the surface of the powder layer portion.
    With reference to FIGS. 3a to 3c, an example of a pattern is illustrated. The pattern is a sinusoid.
    In FIG. 3a, the elements in bold represent the main trajectory comprising sections 301 separated by a spacing 303 and jumps 302, while the elements in thin line represent the modulated trajectory after superposition of the secondary trajectory so as to present oscillations sinusoidal and traversed by the laser spot 304.
    In FIG. 3b, the corresponding secondary or modulation trajectory is represented as variation along an axis as a function of time.
    FIG. 3c details the secondary trajectory between the command associated with the first modulation rotation axis 305 and the command associated with the second modulation rotation axis 306, as a function of time. In the example, the modulation mirror oscillates only around the second modulation rotation axis.
    With reference to FIGS. 4a and 4b, an example of a pattern is illustrated. The pattern is circular.
    In FIG. 4a, the corresponding secondary or modulation trajectory is represented as variation along an axis as a function of time.
    FIG. 4b details the secondary trajectory between the command associated with the first modulation rotation axis 405 and the command associated with the second modulation rotation axis 406, as a function of time. In the example, the modulation mirror oscillates both around the first modulation rotation axis and around the second modulation rotation axis.
    The laser source 110, the modulation device 120 and the scanning device 130 are for example arranged so as to allow a surface melting rate, that is to say the surface of the powder layer covered by the laser spot by time unit, greater than 1000 cm 2 / min, for example greater than 2000 cm 2 / min, for example greater than 4000 cm 2 / min, for example less than 15000 cm 2 / min, for example less than 10000 cm 2 / min, for example of the order of 6000 cm 2 / min. The apparatus according to the invention, by the presence of the modulation device, allows a drastic increase in the surface melting rate and therefore in the surface productivity.
    The modulation device 120 and the scanning device 130 are for example arranged so as to allow so that the speed of movement of the laser spot is between 0.5 and 10 m / s, for example between 1 and 5 m / s , for example equal to 1 or 2 m / s.
    The modulation mirror 121 can be arranged at a converging part of the laser beam coming from the laser source 110, for example downstream of the focusing device 1102 when the scanning device 130 comprises a three-axis scanning head. It is thus possible to limit the disturbance in the quality of the laser beam. Indeed, the laser beam at the output of the optical element for controlling the focusing length 1101 is divergent and only becomes convergent at the output of the focusing device 1102. Place the modulation device 120 elsewhere, in particular further upstream , could disturb the optical functioning by decentering the laser beam.
    Layer and support
    The support includes for example a tray intended to be moved as and when layers are added.
    The or each layer 150 of powder has for example a thickness of between 10 and 100 μm, for example between 20 and 60 μm, for example equal to 40 μm.
    The material of the or each layer 150 of powder has for example a fluence between 0.5 and 10 J / mm 2 , for example between 1 and 5 J / mm 2 , for example equal to 2 J / mm 2 .
    The material of the or each layer 150 of powder may comprise titanium and / or aluminum and / or inconel and or stainless steel and / or maraging steel. The material of the or each layer 150 of powder can consist of titanium and / or aluminum and / or inconel and or stainless steel and / or maraging steel.
    Other source
    In addition to the laser source 110, the apparatus may include a second source. The second source can be a particle beam source, for example an electron beam, for example an EBM source (“Electron Beam Melting” according to the English terminology generally used in the field), for example a cannon with electrons.
    The device 1 can thus be a hybrid device, comprising several sources of energy for carrying out selective fusion. The second source can form a primary source of energy suitable for carrying out selective fusion at the heart of the object. The laser source 110 can form a secondary source of energy suitable for carrying out selective fusion at the periphery zones, for example of the skin or of the edge of the object.
    In this way, it is possible to obtain an object having different mechanical or metallographic properties at its periphery, and in its volume.
    The apparatus 1 may further comprise one or more other laser sources 110, for example such as the laser source described above. One or more other laser sources 110, for example each other laser source 110, can be equipped with a scanning device 130, for example a scanning device 130 as described above, and / or a modulation device 120 , for example a modulation device 120 as described above. It is thus possible to manufacture large parts via a support and large powder layers, using several laser sources and / or scanning device and / or modulation device in parallel to treat different areas of the layer or layers of powder.
    Control means
    The device 1 can include control means suitable for controlling the device, for example for controlling the laser source 110 and / or the modulation device 120 and / or the scanning device 130.
    The control means include or form, for example, a control unit.
    The control means comprise for example data storage means, for example a data storage unit, for example a random access memory and / or a read only memory. The storage means can be adapted to store instructions corresponding to the method described below.
    The control means comprise for example calculation means, for example a processor.
    The control means can be configured to implement a method as described below.
    Process
    Referring to Figure 5, there is described a method of manufacturing a three-dimensional object by selective additive manufacturing.
    The method can be carried out by means of the apparatus 1.
    The method may include a step 400 of controlling the scanning device 130 according to a scanning command of at least part of the layer 150 of powder of additive manufacturing according to the scanning trajectory or main trajectory.
    The method can comprise a step 402, implemented at the same time as the control of the scanning device of step 400, of controlling the modulation device 120 according to a command for modulation of the scanning trajectory. The modulation control of the scanning trajectory corresponds for example to the secondary trajectory or modulation trajectory.
    Steps 400 and 402 can be implemented so that the laser beam follows at the level of the layer 150 of powder a modulated scanning trajectory. The modulated scanning trajectory can correspond to the superposition of the modulation trajectory on the scanning trajectory.
    In the step 400 of checking the scanning device 130, the scanning device can be controlled so as to modify the orientation of the first scanning mirror 131 and / or of the second scanning mirror 132 along the second axis of rotation 134 of scanning at a scanning rotation speed. In step 402 of controlling the modulation device 120, the modulation device 120 can be controlled so as to modify the orientation of the modulation mirror 121 according to the first axis of rotation and / or second axis (s) of rotation, respectively 122 and / or 123, of modulation at the modulation rotation speed. The scanning rotation speed may be lower than the modulation rotation speed.
    Detailed examples
    For a spot diameter of 70 μm, a spot displacement speed of 2 m / s, a layer thickness of 40 μm, a fluence of 2 J / mm 2 , an example of apparatus according to the prior art devoid of the modulating device 120 would require a spacing of 50 μm and would be limited to a laser power of 200 W, so that it would achieve a surface melting rate of 600 cm 2 / min, whereas an example of an apparatus such as the the apparatus described, which includes the modulation device 120, can for example allow a spacing of 500 μm and a width of oscillations of secondary trajectory of 500 μm, and exploit a greater laser power, for example from 1000 to 2000 W, allowing a surface melting rate of 3000 to 6000 cm 2 / min and a surface productivity thus improved by a ratio of 5 to 10.
    权利要求:
    Claims (11)
    [1" id="c-fr-0001]
    claims
    1. Apparatus for manufacturing a three-dimensional object by selective additive manufacturing, comprising:
    a support (140) adapted to support at least one layer (150) of additive manufacturing powder, a laser source (110) adapted to emit a laser beam (111), a scanning device (130) adapted to direct the laser beam on the powder layer so as to scan at least a portion of the powder layer, a scanning path modulation device (120), disposed upstream of the scanning device, the modulation device comprising a modulation mirror (121 ) suitable for reflecting the laser beam coming from the laser source and directing it towards the scanning device, the angle of incidence of the laser beam coming from the laser source on the modulation mirror being between 20 and 45 °.
    [2" id="c-fr-0002]
    2. Apparatus according to claim 1, wherein the scanning device (130) comprises a first scanning mirror (131) and / or a second scanning mirror (132), the scanning device being adapted to modify the orientation of the first scanning mirror along a first scanning axis (133) and / or of the second scanning mirror along a second scanning axis (134), the modulation device (120) being adapted to modify the orientation of the modulation mirror according to a first axis of rotation (122) of modulation and / or a second axis of rotation (123) of modulation.
    [3" id="c-fr-0003]
    3. Apparatus according to claim 2, wherein the scanning device is adapted to modify the orientation of the first scanning mirror (131) along the first axis of rotation (133) scanning over a first range of angle values of scanning and / or the second scanning mirror (132) along the second scanning axis of rotation (134) over a second range of values of scanning angles, in which the modulation device (120) is adapted to modify the orientation of the modulation mirror along the first axis of rotation (122) of modulation over a first range of values of modulation angles and / or the second axis of rotation (123) of modulation over a second range of values of angles of modulation, the first and / or second range (s) of scan angle values being wider than the first and / or second range (s) of modulation angle values.
    [4" id="c-fr-0004]
    4. Apparatus according to claim 2 or 3, wherein the scanning device (130) is configured to modify the orientation of the first scanning mirror (131) along the first scanning axis of rotation (133) and / or of the second scanning mirror (132) along the second scanning rotation axis (134), at a scanning rotation speed, in which the modulation device (120) is configured to modify the orientation of the modulation mirror (121) according to the first modulation rotation axis (122) and / or the second modulation rotation axis (123), at a modulation rotation speed, the scanning rotation speed being lower than the modulation rotation speed.
    [5" id="c-fr-0005]
    5. Apparatus according to any one of claims 1 to 4, wherein the scanning device comprises the first scanning mirror (131) and the second scanning mirror (132), the first scanning mirror being adapted to reflect the beam. laser from the modulation mirror (121) and direct it towards the second scanning mirror, the second scanning mirror being adapted to reflect the laser beam coming from the first scanning mirror and direct it onto the layer (150) of manufacturing powder additive, the system being adapted to control the orientation of the first scanning mirror along the first scanning rotation axis and of the second mirror along the second scanning rotation axis to control the scanning path of the powder layer by the beam laser according to two degrees of freedom in a plane of the powder layer.
    [6" id="c-fr-0006]
    6. Apparatus according to any one of claims 1 to 5, wherein the modulation device (120) is adapted to modulate the trajectory according to a modulation comprising an oscillation at a frequency greater than 1.5 kHz, preferably greater than or equal at 10 kHz.
    [7" id="c-fr-0007]
    7. Apparatus according to any one of claims 1 to 6, wherein the angle of incidence of the laser beam from the laser source on the modulation mirror is between 25 and 35 °.
    [8" id="c-fr-0008]
    8. Apparatus according to any one of claims 1 to 7, wherein the modulation mirror (121) comprises silicon carbide.
    [9" id="c-fr-0009]
    9. Apparatus according to any one of claims 1 to 8, wherein the modulation mirror (121) is an elliptical mirror.
    [10" id="c-fr-0010]
    10. Method for manufacturing a three-dimensional object by selective additive manufacturing, implemented by means of the apparatus according to any one of the preceding claims, comprising the following steps:
    control of the scanning device (130) according to a scanning command of at least a part of the layer (150) of additive manufacturing powder along a scanning trajectory, and at the same time as control of the scanning device, control of the modulation device (120) according to a control of modulation of the scanning trajectory, so that the laser beam follows at the level of the layer (150) of powder a modulated scanning trajectory.
    [11" id="c-fr-0011]
    11. The method according to claim 10, in which:
    in the step of controlling the modulation device (120), the modulation device is controlled so as to modify the orientation of the modulation mirror (121) according to the first and / or second axis (s) of rotation (122, 123) of modulation at a modulation rotation speed, in the step of controlling the scanning device (130), the scanning device is controlled so as to modify the orientation of the first scanning mirror (131) according to the first axis of rotation (133) for scanning and / or the second scanning mirror (132) along the second axis of rotation (134) for scanning, at a scanning speed of rotation lower than the modulation rotation speed.
    类似技术:
    公开号 | 公开日 | 专利标题
    FR3080321A1|2019-10-25|APPARATUS AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECT
    CH640448A5|1984-01-13|PROCESS FOR DEBURRING A MECHANICAL PART AND DEVICE FOR IMPLEMENTING THE PROCESS.
    EP3352974B1|2019-08-21|System and method for additively manufacturing by laser melting of a powder bed
    WO2015059388A1|2015-04-30|Modular laser apparatus
    FR3012226A1|2015-04-24|MODULAR LASER APPARATUS
    WO1997043682A1|1997-11-20|Aperture-synthesis diffractive optical device and laser cutting device comprising same
    FR2459991A1|1981-01-16|METHOD AND DEVICE FOR DETECTING A FOCUSING ERROR SIGNAL
    FR2977513A1|2013-01-11|Cutting a workpiece e.g. stainless steel by laser beam, comprises generating laser beam having Gaussian-type intensity distribution using laser source, and modifying laser beam so as to obtain ring type intensity distribution laser beam
    TWI454331B|2014-10-01|Variable depth of field optical system and modulating method and optical method for process material
    EP0995145B1|2001-09-19|Diffractive optics with synthetic aperture and variable focal length and laser cutting device incorporating such an optics
    EP0038297B1|1984-07-18|Method of deburring a sharp instrument, apparatus to use the method and sharp instrument obtained by the method
    EP3956095A1|2022-02-23|Method for the creation of an iridescent effect on the surface of a material, and devices for carrying out said method
    BE1027700B1|2021-05-18|Device for a laser machining optical system
    BE1025341B1|2019-02-04|METHOD FOR STRUCTURING A SUBSTRATE
    FR3110094A1|2021-11-19|Method of additive manufacturing of an object from a layer of powder
    FR2692067A1|1993-12-10|Prodn. of components from photo-transformable materials - having a mechanical device to vary light spot area, for rapid prototyping of industrial components
    FR3049847A1|2017-10-13|CUTTING PATTERN OF AN APPARATUS FOR CUTTING A HUMAN OR ANIMAL TISSUE
    FR3049848A1|2017-10-13|OPTICAL SYSTEM FOR FOCUSING AN APPARATUS FOR CUTTING A HUMAN OR ANIMAL TISSUE
    WO2021229172A1|2021-11-18|Method for the additive manufacture of an object from a powder layer
    EP2002436A1|2008-12-17|Solid immersion lens with increased focusing capacity
    FR2872351A1|2005-12-30|Ultra-short laser for e.g. micromachining, has laser source followed by device for dynamic conformation of laser beam, which in turn is followed by device for applicative implementation of laser beam after its conformation
    EP1249301A1|2002-10-16|Device and associated process of so called laser welding bi-layer
    FR3099636A1|2021-02-05|Laser treatment system and method
    WO2021038453A1|2021-03-04|Laser machining device
    FR3049853A1|2017-10-13|OPTICAL SCANNER FOR SCANNING AN APPARATUS FOR CUTTING A HUMAN OR ANIMAL TISSUE
    同族专利:
    公开号 | 公开日
    US20210178481A1|2021-06-17|
    KR20210003823A|2021-01-12|
    CN112313079A|2021-02-02|
    FR3080321B1|2020-03-27|
    WO2019207239A1|2019-10-31|
    JP2021522072A|2021-08-30|
    EP3784492A1|2021-03-03|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US5508489A|1993-10-20|1996-04-16|United Technologies Corporation|Apparatus for multiple beam laser sintering|
    US20110299147A1|2007-11-27|2011-12-08|Duke University|High-Speed Multi-Dimensional Beam Scanning System With Angle Amplification|
    US20170173876A1|2015-12-17|2017-06-22|Lilas Gmbh|3D printing device for producing a spatially extended product|
    FR3110096A1|2020-05-12|2021-11-19|Addup|Method of additive manufacturing of an object from a layer of powder|
    FR3110094A1|2020-05-12|2021-11-19|Addup|Method of additive manufacturing of an object from a layer of powder|
    WO2022018149A1|2020-07-21|2022-01-27|Trumpf Laser- Und Systemtechnik Gmbh|Manufacturing device for additive manufacturing of components from a powder material, method for changing a beam profile of an energy beam, and use of at least one acousto-optical deflector|
    WO2022018148A1|2020-07-21|2022-01-27|Trumpf Laser- Und Systemtechnik Gmbh|Manufacturing device and method for additive manufacturing of a component from a powder material, and method for producing a specific intensity profile of an energy beam|
    法律状态:
    2019-04-18| PLFP| Fee payment|Year of fee payment: 2 |
    2019-10-25| PLSC| Search report ready|Effective date: 20191025 |
    2020-04-20| PLFP| Fee payment|Year of fee payment: 3 |
    2021-04-23| PLFP| Fee payment|Year of fee payment: 4 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1853547|2018-04-23|
    FR1853547A|FR3080321B1|2018-04-23|2018-04-23|APPARATUS AND METHOD FOR MANUFACTURING A THREE-DIMENSIONAL OBJECT|FR1853547A| FR3080321B1|2018-04-23|2018-04-23|APPARATUS AND METHOD FOR MANUFACTURING A THREE-DIMENSIONAL OBJECT|
    PCT/FR2019/050942| WO2019207239A1|2018-04-23|2019-04-19|Apparatus and method for manufacturing a three-dimensional object|
    KR1020207033161A| KR20210003823A|2018-04-23|2019-04-19|Apparatus and method for manufacturing a three-dimensional object|
    JP2020559406A| JP2021522072A|2018-04-23|2019-04-19|Equipment and methods for manufacturing 3D objects|
    US17/050,250| US20210178481A1|2018-04-23|2019-04-19|Apparatus and method for manufacturing a three-dimensional object|
    CN201980040671.1A| CN112313079A|2018-04-23|2019-04-19|Apparatus and method for manufacturing three-dimensional objects|
    EP19728475.5A| EP3784492A1|2018-04-23|2019-04-19|Apparatus and method for manufacturing a three-dimensional object|
    [返回顶部]